| Layers |
2 – 24 |
| Min. Board Thickness |
| 2 layers |
4 layers |
6 layers |
8 layers |
10 layers |
| min. 0.2mm |
0.40mm |
1.00mm |
1.20mm |
1.50mm |
|
| 12 & 14 layers |
16 layers |
18 layers |
20 layers |
22&24 layers |
| 1.60mm |
1.7mm |
1.8mm |
2.2mm |
2.6mm |
|
|
| Max. Board Size |
610 x 1200mm (24.0″ x 47.2″) |
| Base Material |
FR-4, Aluminium base, RCC |
| Surface Finish Treatment |
Immersion gold; HAL tin lead, leadfree; immersion silver |
| Via Holes |
Copper PTH / Blind Via / Buried Via |
| Copper Foil Thickness |
18um / 35um / 70um ~ 245um (outerlayer:0.5oz~7oz)
18um / 35um / 70um ~ 210um (innerlayers:0.5oz~6oz) |
| Min. size of trace and pitch |
0.075 mm / 0.10 mm (3 mil./ 4 mil.) |
| Min. size of vias and pads |
via: dia. 0.2mm / pad: dia. 0.4mm ; HDI <0.10mm via |
| Solder Mask |
Liquid Photo-image (LPI) |
| Mechanical treatment |
CNC Routing, V-cutting, Punching, |
